Archive

Posts Tagged ‘sony vaio vgn-fs790 cpu cooler’

What Kind of CPU Fan Do You Need?

September 9th, 2013 No comments

The PC basic that keeps your CPU air-conditioned consists of two abstracted genitalia – the calefaction sink, which is about a block of metal, advised to aerate airflow and apparent area. The additional allotment is the fan. Together they’re frequently referred to as the heat-sink/fan admixture or HSF, for short. Lots of technologies and aftermarket articles exist. Some are advised to abate babble while others are advised Sony Vaio Vgn-fz460e cpu fan for best cooling. All of them, however, crave you apperceive a few things about your computer.

Determining what array of CPU fan you charge takes bristles steps.

First, acquisition your motherboard’s CPU socket.

Second, admeasurement the accessible acme in your case amid the top of the CPU and the console of the computer’s chassis.

Third, audit the breadth on your motherboard surrounding the CPU socket.

Fourth, actuate how fast you appetite the fan to run.

Fifth, acquisition the Thermal Architecture Power (TDP) of your CPU, if you are not application the banal (the one that comes with the CPU) HSF combo. TDP is the calefaction achievement of your CPU, abstinent in watts.

how to mount a cpu fan

Step one, get the atrium type: There’s a array of CPU sockets out there. Fortunately, the all-inclusive majority of avant-garde CPUs abatement into one of three kinds:

Intel LGA775: Unfortunately, Intel heat-sink/fan combos alter beyond generations. If you accept a LGA775 atrium CPU, it will crave either an LGA775 accordant Intel heat-sink/fan combo, or a complicated “universal” after-market HSF. An barring to this aphorism is the alteration amid LGA775 and LGA1155. You can additionally use LGA1155 calefaction sinks on LGA775, although there may be some affinity issues, decidedly with affiliated coolers.

Intel LGA1155: In general, Intel did not rationalize its fan design. Intel tends to use a altered calefaction bore for anniversary of its CPUs. About LGA775 and LGA1155 HSFs are mostly cross-compatible. The fresh Haswell LGA1150 atrium appears to additionally assignment with LGA1155 and LGA11775 sockets.

AMD AM2, AM2+, AM3, AM3+, FM1 and FM2: Conveniently, about all avant-garde AMD atrium types use changeable CPU heat-sink/fans. If you sony vaio vgn-fs790 cpu cooler accept one of these AMD models, about all calefaction sink/fans assignment interchangeably, provided they can handle the calefaction produced by the CPU.

Remember these issues, because there’s a big aberration amid the way you would administer a heat-sink/fan to AMD or Intel CPUs.

Step two, admeasurement your anatomy height: Some CPU admirers can be too alpine for your case, decidedly if you accept a baby anatomy agency PC build, such as mini-ITX or microATX. Be abiding to admeasurement from the abject of the CPU to the top of your case.

mount cpu fan

Step three, analysis your motherboard: Some motherboards align a abundant cardinal of apparatus about the CPU, which accomplish ascent annihilation added than the banal acknowledgment impossible. Admeasurement the ambit surrounding the CPU to the abutting capacitor or added component. heat-sink/fan combos will not fit if they beat this distance.

mount cpu fan

Step four, actuate your fan’s speed: Some motherboards alone use a three-pin CPU fan adapter (clearly labeled CPU fan), acceptation it isn’t fed Pulse-width accentuation (PWM) commands, which attune the fan’s acceleration in affiliation to the temperature of the motherboard. Most three-pin boards run admirers at their best rated speed. Logically, a three-pin CPU fan is advised to run at best speed, back it has no fourth pin. However, it should be acclaimed that some motherboards can ascendancy a three-pin fan through a sony vaio vgn-nr480e cpu cooling fan built-in voltage ascendancy method.

Step five, acquisition your CPU’s TDP: As mentioned above, admirers accept TDP ratings, abstinent in watts. This is the best bulk of calefaction that the fan can auspiciously aperture from a CPU. The heat-sink/fan admixture should accommodated or beat the TDP of your CPU.